Staff Packaging Development Engineer

ABOUT THE POSITION:Qorvo seeks a seasoned Packaging Development Engineer with a robust background in semiconductor packaging development and integration. This role involves leading new packaging technologies and assembly capabilities, with a focus on SMT process expertise and innovation in packaging solutions.RESPONSIBILITIES:• Develop and integrate new semiconductor packaging technologies.• Manage technical projects for packaging technology advancement.• Serve as a lead expert in packaging assembly processes, especially SMT.• Innovate in package design, processes, and materials for next-generation solutions.• Offer technical guidance during development phases and address high-volume production challenges.• Spearhead projects from concept through to qualification and production in collaboration with R&D.• Support technical customer engagements and problem resolution.• Drive continuous process improvement (CPI) in packaging and support cross-functional areas.• Collaborate with offshore assembly, substrate partners, and suppliers.• Present project updates to executive management and contribute to patent creation.