Minimum qualifications:
Bachelor's degree in
Electrical Engineering, Computer Engineering, Mechanical Engineering, a related field, or equivalent practical experience.
2 years of experience in manufacturing process development in semiconductor packaging or Surface Mount Technology.
Experience with development of PCBA manufacturing processes including acceptance testing, startup, and qualification.
Experience in new site/line/equipment bring-up/transfer and qualification for PCBA and system integration.
Preferred qualifications:
Master's degree in Mechanical, Industrial, or Electrical Engineering, or a related discipline.
Experience with Product Data Management (PDM) tools (e.g., SAP, Agile, Windchill).
Experience developing solid, effective technical relationships with contract manufacturers and vendors.
Experience in SMT manufacturing and process development for datacenter hardware, including applying DFM, DOE, thermo-mechanical dynamics, and process optimization.
Ability to drive root cause analysis, corrective actions, and continuous process improvements with cross-functional teams, contract manufacturers, and suppliers.
Demonstrate ability to communicate effectively with multi-geographic teams, collaborate to achieve project goals, contribute positively to the engineering community, manage complex projects spanning multiple technologies.