Equipment Engineer (PCB / Semiconductor Package)

The Equipment Engineer is responsible for overseeing, maintaining, and optimizing PCB and package substrate manufacturing equipment and processes to ensure high efficiency, product quality, and cost-effective operations.
1. Machine Development & Management:
• Develop, install, and manage manufacturing equipment for PCB and package substrate processes, including Drilling, Lithography, Final Inspection, Solder Resist, Solder-on-Pad, Lamination, Copper Plating, and Gold Plating.
• Establish and maintain machine control plans and documentation (SOPs, WI, PFMEA, Control Plan).
• Validate new equipment and conduct process capability studies.
2. Process Improvement:
• Monitor key equipment and process KPIs, including Capacity Utilization, MTBA, MTBF, OEE, and Yield, and drive continuous improvement actions.
• Conduct root cause analysis of equipment and process issues and implement CAPA (Corrective and Preventive Actions).
• Lead cost reduction and efficiency improvement projects
3. Technical Support:
• Provide daily technical support to production teams to resolve process-related issues.
• Coordinate with quality, maintenance, and production departments to ensure stable operations.
• Train operators and technicians on standard procedures and process changes.