Company Description
The Bosch Group is a leading global supplier of technology and services. Since the beginning of 2013, its operations have been divided into four business sectors: Automotive Technology, Industrial Technology, Consumer Goods, and Energy and Building Technology.
The Bosch Group comprises Robert Bosch GmbH and its roughly 360 subsidiaries and regional companies in some 50 countries. If its sales and service partners are included, then Bosch is represented in roughly 150 countries. This worldwide development, manufacturing, and sales network is the foundation for further growth.
Bosch Global Software Technologies Company Limited (BGSV) is 100% owned subsidiary of Robert Bosch GmbH - one of the world's leading global suppliers of technology and services, offering end-to-end Engineering, IT, and Business Solutions.
Starting its operation from 2010 at Etown 2 in HCMC, BGSV is the first software development center of Bosch in Southeast Asia. BGSV nowadays have over 4,000 associates, with a global footprint and presence in the US, Europe, and the Asia Pacific region.
With our unique ability to offer end-to-end solutions that connect sensors, software, and services, we enable businesses to move from the traditional to digital or improve businesses by introducing a digital element in their products and processes.
Job Description
Develop electronic hardware for automotive HPC and chiplet platforms, with a primary focus on signal integrity and power integrity (SI/PI) simulation and analysis, complemented by electronic circuit design. Drive simulation-based decisions for high-speed interfaces, power delivery, and PCB/package integration, and deliver board designs from requirements through validation.
Key Responsibilities:
Define SoC board specifications, select components, and develop schematics and verification criteria.
Design power, sequencing, clock/reset, and interfaces: PCIe Gen 3/4/5, LPDDR5, USB 3.x, SGMII/RGMII, and 10G Automotive Ethernet.
Review PCB placement, routing, fabrication readiness, power budgets, thermal margins, and reliability with development/manufacturing partners
Own SI/PI plans, budgets, and acceptance criteria; simulate DDR/LPDDR, PCIe, Ethernet, and SerDes before/after layout for loss, crosstalk, reflections, timing, jitter, eyes, and corner margins.
Build and validate PCB/package models using 2D/3D EM extraction, S-parameters, and IBIS/IBIS-AMI; assess model quality and limitations.
Analyze PDN IR-drop, current density, impedance, resonances, and transients; optimize power/ground structures and decoupling for rail-noise and impedance targets.
Derive PCB/package constraints for stack-ups, materials, impedance, routing, vias, return paths, and capacitors; support EMI/EMC simulation as needed.
Correlate simulations with oscilloscope, TDR, VNA, and rail measurements; resolve model, interconnect, PDN, and measurement discrepancies.
Lead SI/PI reviews and verified issue closure; maintain traceable reports, reusable flows, scripts, and guidelines
Customer document preparation (app note);
Qualifications
Qualifications
Bachelor's in Electrical/Electronic Engineering or equivalent;
8+ years in electronic hardware engineering, with substantial SI/PI simulation ownership guiding board/package design at least 3 years
SoC board design experience covering power, clock/reset, memory, and high-speed interfaces;
Proficiency in Cadence Allegro/OrCAD, Altium
Designer, or Siemens EDA; DFM/DFT and EMI/EMC knowledge.
Schematic/layout review, bring-up, validation, and release experience using oscilloscopes, multimeters, and programmable supplies; BERT/VNA/TDR a plus.
Strong EM/transmission-line fundamentals: impedance, coupling, return paths, S-parameters, and time/frequency-domain analysis.
PDN modeling, IR-drop, impedance, decoupling, and transient analysis tied to rail/load requirements and margins.
SI/PI tool proficiency: Ansys SIwave/HFSS/Q3D, Cadence Sigrity/Clarity, HyperLynx, or Keysight ADS; circuit simulation and applicable IBIS/IBIS-AMI workflows.
DDR/LPDDR, PCIe, Ethernet, or SerDes analysis and measurement correlation; PCB stack-up, HDI, BGA escape, and package-parasitic knowledge.
Python/MATLAB automation and data analysis preferred; automotive HPC, chiplet/package-board co-design, and UCIe are advantages.
Soft skills
Result oriented
Strong analytical and problem-solving mindset
Structured and quality-driven working approach
Ability to work effectively in cross-functional and global teams
Good English communication (spoken & written)
Additional Information
Further details regarding compensation and benefits will be shared during the interview process.