Trivita AI is hiring a PCB Design Engineer with 3+ years of experience in HDI PCB design, high-speed layout, RF, and smart glasses hardware.
With the goal of expanding our team to 150-200 employees in 2027, Trivita AI is looking for talented individuals to join us in our next phase of growth.
As a PCB Design Engineer (Smart Glass Hardware), you will take primary responsibility for PCB design, from schematic capture and layout to hardware bring-up, supporting both prototype iterations and production-ready smart glasses hardware.
Smart glasses integrate cameras, microphones, wireless connectivity, compact batteries, and multiple electronic components within strict constraints on size, weight, power consumption, and thermal performance.
You will collaborate closely with Embedded Firmware, Industrial Design (ID), and Mechanical Engineering (ME) teams to develop compact, high-density PCB solutions that meet performance and manufacturing requirements.
Responsibilities
PCB design and hardware integration
- Design schematics and PCB layouts for smart glasses hardware, including mainboards, sensor/camera boards, battery/charging boards, and flex/rigid-flex PCBs integrated into the glasses frame.
- Develop high-density, multilayer HDI PCB layouts (4-8+ layers) using via-in-pad, microvias, and fine-pitch BGAs.
- Route high-speed interfaces such as MIPI CSI/DSI, USB 2.0/3.x, LPDDR, eMMC/UFS, SPI, I2S, and I2C.
- Apply controlled impedance, length matching, and differential pair routing techniques to maintain signal integrity.
- Design RF and antenna layouts for BLE, Wi-Fi, and potentially GNSS, including matching networks, keep-out areas, grounding, and antenna placement within the frame.
- Design power management circuits involving PMICs, buck/boost converters, LDOs, Li-Po/Li-ion battery charging, fuel gauges, and battery protection.
- Optimize power integrity and power consumption for wearable applications.
Cross-functional product development
- Collaborate with Mechanical Engineering and Industrial Design teams on board dimensions, PCB stack-ups, connector placement, flex bending radius, thermal management, and board thickness.
- Select electronic components based on technical requirements, form factor constraints, and supply availability.
- Create and maintain ECAD libraries, including footprints and 3D models.
- Review Bills of Materials (BOMs), component availability, and potential alternatives.
- Ensure designs meet Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Testability (DFT) requirements.
- Work with PCB/PCBA manufacturers to review Gerber files, address manufacturing feedback, and improve production readiness.
Hardware bring-up and validation
- Participate in hardware bring-up, functional verification, and troubleshooting of prototype boards.
- Use oscilloscopes, logic analyzers, thermal cameras, and other measurement equipment to diagnose hardware issues.
- Identify root causes and implement design improvements for subsequent PCB revisions.
- Support signal integrity (SI), power integrity (PI), EMI/EMC assessments, and preparation for CE, FCC, or KC certification when required.
- Maintain design documentation, engineering checklists, release packages, and version control using Git or PLM systems.
Requirements
- Bachelor's degree in Electronics Engineering, Telecommunications Engineering, Mechatronics, or a related field.
- 3+ years of PCB design experience, with at least 2-3 products or functional prototypes successfully developed.
- Proficiency in at least one ECAD tool, preferably Altium Designer, or alternatives such as Cadence Allegro/OrCAD or KiCad.
- Hands-on experience designing HDI and compact, high-density PCBs, including BGA pitch ≤0.5 mm and [protected info] components.
- Experience routing high-speed interfaces such as MIPI, USB, and DDR, with a solid understanding of PCB stack-up and impedance calculations.
- Strong knowledge of digital, analog, and power electronics fundamentals.
- Ability to interpret semiconductor datasheets and manufacturer reference designs.
- Practical hardware debugging skills and proficiency with essential laboratory measurement equipment.
- Ability to read technical documentation in English and collaborate effectively across engineering teams.
Technology and tools
- ECAD: Altium Designer, Cadence Allegro/OrCAD, KiCad.
- PCB Design: HDI, Multilayer PCB, Flex/Rigid-flex, Via-in-pad, Microvia, BGA.
- High-speed Interfaces: MIPI CSI/DSI, USB 2.0/3.x, LPDDR, eMMC/UFS, SPI, I2S, I2C.
- RF & Wireless: BLE, Wi-Fi, GNSS, Antenna Matching.
- Power Management: PMIC, Buck/Boost, LDO, Li-Po/Li-ion Charging, Fuel Gauge.
- Hardware Debug: Oscilloscope, Logic Analyzer, Thermal Camera.
- Manufacturing: DFM, DFA, DFT, Gerber, BOM, PCB/PCBA.
- Version Management: Git, PLM.
Preferred qualifications
- Experience developing hardware for smart glasses, AR/VR devices, earbuds, smartwatches, wearables, or compact IoT/Edge AI devices.
- Experience with flex and rigid-flex PCB design.
- Familiarity with edge SoCs, MCUs, or NPUs from Qualcomm, MediaTek, NXP i.MX, Rockchip, Ambarella, Nordic, or ESP32 platforms.
- RF/antenna design experience and familiarity with SI/PI simulation tools such as HyperLynx, Ansys SIwave, or Sigrity.
- Experience with low-power design, battery management, and thermal optimization for wearable electronics.
- Knowledge of IPC standards (IPC-2221, IPC-2222, IPC-A-610), EMC pre-compliance, and EVT/DVT/PVT development processes.
- Python scripting skills for automating design checks, DRC, and BOM validation.
- Direct experience collaborating with PCB manufacturers or EMS partners in Vietnam, China, or Taiwan.
Contact information
- Address: No. 01, Street 104, Quarter 3, Binh Trung Ward, Ho Chi Minh City
- Phone: [protected info]