The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology Integration Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers.
In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners.
Please note: This role requires periodic meetings with suppliers in East Asia and stakeholder in US, as well as frequent presence at supplier sites to support essential program objectives.
Responsibilities
• Collaborate with suppliers and internal engineering teams to develop robust building block processes across component embedding, core fabrication, laser drilling, dielectric lamination, lithography, electrolytic multi metal plating, defect inspection/metrology, electrical testing, and other substrate technologies.
• Partner closely with on site supplier engineering teams and the APTD Substrate Integration team to advance substrate building block technologies and manage critical process interactions.
• Ensure suppliers meet all Product Control System (PCS) commitments with rigor and consistency.
• Work with cross functional teams to design and implement new factory technology validation and product certification plans focused on yield improvement.
• Develop and maintain detailed micro schedules for new factory startup activities, including key milestones, to ensure supplier alignment with startup timelines.
• Lead qualification activities and monitor ramp indicators to enable an incident free production ramp and successful introduction of new capacity.
• Bachelor's degree with 8+ years of experience, OR Master's degree with 6+ years of experience, OR PhD with 2+ years of experience in Mechanical Engineering, Materials Science, Chemical Engineering,
Electrical Engineering, Physics, or a related technical field.
• Strong English communication skills are required.
Experience listed above should be in the following:
• Statistical tools and methods, including Statistical Process Control (SPC) for yield improvement.
• Experience managing complex projects and deliver results in high-volume manufacturing environments.
• A strong foundation in advanced packaging, substrates, or semiconductor manufacturing; proven leadership in supplier management or technology enablement; and the ability to drive alignment and execution across global teams.
• Proven ability to thrive in high-ambiguity environments and deliver results under pressure. Knowledge of advanced packaging technologies and substrate/assembly manufacturing methodologies.
• Experience with process flow development, FMEA, DOE design, and problem-solving tools.