Minimum qualifications:
Bachelor's degree in
Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of industry experience in the SI/PI field.
Experience in chip package SI/PI design for interconnections and advanced package design.
Preferred qualifications:
Experience in post silicon correlation with models.
Experience with 2.5D/3D package design such as silicon interposer, silicon bridge, 3D die stacking.
Experience in cross-functional collaboration with chip top design, physical design, STA, package, system design, and validation teams.
Experience in programming and data analysis with Matlab, Python, C++ and statistical tools to establish automation flows and data processing.
Understanding of on and off chip power delivery and STA/voltage budget.
Familiarity with memory testing, next generation memory, chiplet standards and timing budget methodology.