Responsibilities
Lead the Development of Advanced PCBA / SI Mfg capabilities in the Vietnam sites
Collaborate and interact with customer technical team and Foxconn R&D to co-develop Test
Vehicle, Technical Spec/Checklist, Reliability Testing, DFM and Process for new assembly, rework technology, component packaging and / or process material. Fostering strong and collaborative relationships with clients and internal cross functional teams.
Lead the Mfg technical team and work the labs at Vietnam and global labs to perform all the process
and reliability evaluation regularly. .
Support Foxconn central and other sites and BUs to share and develop new Advanced Mfg
Capabilities .
Develop and mentor leaders to have good people skill and as well-rounded, high-potential technical
professionals.
Requirements
Bachelor's or Master's degree in Engineering, Material Science, Statistics, or related fields.
Minimum of 10 years of Mfg Engineering and Process / Technology Development experience for
PCBA and SI and minimum 5 years in management position.
At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM)
environment with a proven record.
Knowledge and experience of PCBA with large size BGA (> 80 mm x 80 mm), Co-Packaged
Optics, Thermal Compression Bonding, High speed connector / flying cable, and Liquid Cooling are preferable,
Strong English communication skills (listening, speaking, reading, and writing) and excellent
interpersonal skill
Ability to lead projects from beginning to end and drive initiatives with a global team.
Ability to work under pressure.
Work location is in Vietnam
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