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Facility Mechanical Engineering Intern/Thermal Engineering (HVAC/MEP)

CÔNG TY TNHH INTEL PRODUCTS VIỆT NAM

Địa điểm làm việc: Hồ Chí Minh
Hết hạn: 26/08/2024

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Job Description

Corporate Services CS provides Intel employees the infrastructure and environment to create breakthrough technology that makes amazing experiences possible. Our scope is vast, whether we are providing services that help employees stay productive and satisfied, or transforming how we work by providing ultra-pure water/chemicals to factory process tools, shuttling employees between sites, protecting the environment, keeping employees safe, or building and maintaining offices, labs, and factories. Our employees create a better tomorrow for all Intel employees around the world.
  • The Mechanical Engineering Intern will work closely under the direct supervision of a senior engineer to perform specific engineering tasks of analysis or test nature in specialized engineering fields.
  • Provides facilities engineering and operational support focusing on mechanical systems such as stated below:
- HVAC Heating Ventilating Air Conditioning.-
Oil Free Air Compressed Air and Vacuum systems.
- Chiller water plant.
- Exhaust and Pump systems.
  • Owning safety within an area of influence ensuring systems operate reliably to avoid manufacturing, facility, or operations impacts by meeting uptime goals.
  • Effective collaboration with construction and operations teams to coordinate work in the field overlooking projects to meet design criteria, scope, budget, and schedule oversight of planning, design, reconfiguration, construction, maintenance, and modifications to equipment, machinery, facilities systems, buildings, and structures as required to support business requirements,
  • Delivering operational efficiency, maintenance, testing, and commissioning solutions,
  • Identify and implement opportunities to achieve the lowest cost of ownership to key stakeholders while maintaining reliability,
  • Collaboration with the Site Facility management team, suppliers, and key stakeholders through an in-depth understanding of the operating systems to determine and ensure compliance with existing standards, specifications, building codes, and processes.

Qualifications

Minimum Qualification Skills (Must Have Skills):
  • You must be the Third-year or Final-year student currently pursuing a Bachelor's degree in Mechanical Engineering or Thermal Engineering (HVAC/MEP).
  • Skill: Knowledge of the practical application of mechanical engineering science and technology. This includes applying principles, techniques, procedures, and troubleshooting skills.
  • Design: Knowledge of Industrial heating ventilation and Air conditioning HVAC and design techniques, tools, and principals involved in the production of precision technical plans, blueprints, drawings, and models.
  • Candidate who is equipped with experience in HVAC, Compressed Air Systems, Exhaust, Vacuum, and pump systems is preferred.
  • Strong communication skills, both written and verbal in English and must be willing to work effectively as an individual with minimal direction and as part of a larger team.
  • Able to commit to 6-9 months of internship.
  • Able to work onsite for at least 30 hours per week. ​
  • Expected graduation date (including temporary graduation) should be after March 2025.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Your privacy matters to Intel and we comply with applicable data protection laws. We collect and maintain personal information for recruitment related activities and your data will not be used for any other purpose. We retain personal information for the periods and purposes set forth in Intel Privacy Notice. Retention periods can vary significantly based on the type of information and how it is used. We do not share your personal information with third parties. In order for Intel to communicate with you on your application results, by submitting your information and proceeding with this application, you agree and consent that we can collect your personal information. You will have the ability to opt-out by informing [protected info] or at any time selecting unsubscribe found at the bottom of our future marketing communications. You have rights to correct, update, request access to or deletion of your personal information as described in Intel Privacy Notice. In addition, if you wish to update or otherwise make changes to your resume, use Intel online application tool to resubmit a new resume.

Working Model

This role will require an on-site presence.

Thông tin chung

  • Ngày hết hạn: 26/08/2024
  • Thu nhập: Thỏa thuận
Giới thiệu công ty Xem trang công ty
Công ty chưa cập nhật thông tin....
Quy mô công ty
Từ 1000 - 5000 nhân viên
CÔNG TY TNHH INTEL PRODUCTS VIỆT NAM
Địa chỉ công ty: Saigon Hi-Tech Park (SHTP)

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