New Product Development Senior Engineer

Job Summary
ð New Package and Technology Development.
Key Responsibilities
ð Involve in tooling design, new material exploration, new generation die technology characterization and new technology of assembly for semiconductor industry
ð Troubleshooting the issue during development stage with analytical and technical skill
ð Exploring new technology in the market and competitor movement.
ð Develop process flow for new package development in semiconductor.
KNOWLEDGE, SKILLS AND ABILITIES
ð Proficient in written and conversational English.
ð Strong knowledge in Transfer Molding, Mold compound material is a must
ð Have knowledge in Plating, Trim and Form is preferred.
ð Semiconductor processes and Material knowledge on Mold Compound, wire, and solder OR a very quick learner and walk extra miles to pick up new knowledge.
ð Equipment and tooling design and hands on experience.
ð Proactive and initiative to look for solution
ð Able to work independently
ð Understand DOE and process characterization.
ð Min level 3 AutoCAD application.
ð Added advantage with SPC software application such as JMP and statical software.
ð Understand solid state of semiconductor especially on integrated circuit design and application.