- More than 3-5 years' experience in R&D Engineer, NPI/NPD as a
Project Manager, SMT Engineer, Mold Engineer or in a related field
- Experience in statistical analysis tools such as JMP or Minitab
- Experience in semiconductor packaging processes
- Skilled in report preparation and customer communication
* Skill:
- English skill(speaking/listening/writing) is mandatory
- Excellent team collaboration, effective communication and presentation skills
- Prefer to experience of Stabilizing process of SMT, Mold, Pkg/Saw, AVI/FVI etc.
- Familiarity with SMT equipment and processes: SPP, SPI, Chip Mounter, Reflow, Flux Cleaning/Mold equipment and processes/ semiconductor * * PKG equipment and processes
- Skilled in AOI recipe creation using Parmi/Pemtron machines/ Molding recipe control/ PKG machine recipe control
- Proficient in MS Office (Excel, Word and PowerPoint)
- Trouble shooting for process problem/customer complaint
- Failure Analysis for process problem/customer complaint, RMA and 8D report
- Real time communication with customer to share customer requesting
- Regular meetings and reporting with customers
* Other: Willing to train and work abroad (Korea) for about 3-6 months