A. Education & Experience
Education:Bachelor's degree in
Electrical Engineering, Mechanical Engineering, or a related field.
Experience:A minimum of 3-5 years of experience in equipment engineering within the semiconductor manufacturing industry, with hands-on experience in maintaining and optimizing FOL assembly equipment.
Technical & Soft Skills
Technical Skills:
Proficiency in reading and interpreting engineering schematics and technical drawings.
Strong understanding of semiconductor assembly processes and associated equipment.
Experience with equipment calibration, maintenance protocols, and troubleshooting techniques.
Familiarity with software tools for data analysis and equipment monitoring.
Soft Skills:
Excellent problem-solving and analytical abilities.
Strong communication and interpersonal skills for effective collaboration across departments.
Ability to manage multiple tasks and prioritize effectively in a fast-paced environment.
Detail-oriented with a commitment to maintaining high-quality standards.
Certifications & Licenses (If applicable)
While not mandatory, certifications such as Certified Manufacturing Engineer (CMfgE) or similar credentials are advantageous..
Physical Requirements & Work Environment
Physical Requirements: Ability to perform tasks such as standing for extended periods, lifting equipment components up to 25 kg, and working in cleanroom environments.
Work Environment: Primarily a cleanroom manufacturing setting with exposure to various tools and machinery. May require working outside regular business hours to address equipment issues or conduct maintenance activities.
