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■ Package Substrate Product Quality Manager:
- Quality Management System (QMS): Develop, implement, and maintain QMS in compliance with international standards (such as ISO 9001, IATF 16949, and IPC standards). Lead internal and external quality audits.
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Customer Quality Engineering (CQE): Act as the primary point of contact for global semiconductor customers regarding quality issues, audits, and product qualifications. Manage customer complaints, RMA (Return Material Authorization), and drive timely 8D / CAPA resolutions.
- Supplier Quality Management (SQM): Establish supplier quality standards, conduct supplier audits, and monitor the performance of raw material vendors (e.g., copper foil, prepreg, dry film, solder mask).
- Process & Product Quality Control: Oversee IQC, IPQC, OQC, and Reliability Testing (ORT) teams. Monitor yield rates, defect trends, and statistical process control (SPC) data to prevent quality excursions.
- New Product Introduction (NPI): Partner with R&D, Process Engineering, and Production teams during NPI phases to ensure smooth qualification (APQP, PPAP, FMEA, Control Plans) of next-generation IC substrates (e.g., FC-BGA, FC-CSP).
- Team Leadership & Continuous Improvement: Lead, mentor, and develop a team of QA/QC engineers and inspectors. Champion Lean Six Sigma methodologies to reduce defect rates (DPPM) and improve overall manufacturing yield.
- Bachelor's degree or higher in an engineering-related field; able to communicate in English
- Preferred majors: Chemical Engineering, Materials Science, Electrical/Electronic Engineering, Mechanical Engineering, Industrial Engineering, etc.
- Candidates with 3+ years of experience are preferred
- Technical Knowledge:
• Deep understanding of package substrate manufacturing processes (e.g., SAP/mSAP, lithography, plating, lamination, surface finishing like ENIG/ENEPIG, electrical testing, and AVI/AOI).
• Strong proficiency in quality core tools: 8D, FMEA, MSA, SPC, APQP, PPAP, and Root Cause Analysis (5-Why, Fishbone).
• Familiarity with reliability testing standards (JEDEC, IPC) and failure analysis (FA) techniques (X-ray, cross-section, SEM/EDX).
* For Customer Quality Team Leader, fluent English is preferred